Title :
Test data compression and compaction for embedded test of nanometer technology designs
Author :
Rajski, Janusz ; Tyszer, Jerzy
Author_Institution :
Mentor Graphics Corp., Wilsonville, OR, USA
Abstract :
We examine various forms of embedded deterministic test with particular emphasis on input stimuli compression and test response compaction schemes. Subsequently, the embedded deterministic test (EOT) scheme, which significantly reduces manufacturing test cost by providing a dramatic reduction in scan test data volume and scan test time, is discussed.
Keywords :
automatic test pattern generation; boundary scan testing; data compression; design for testability; embedded systems; fault diagnosis; embedded deterministic test; manufacturing test cost; nanometer technology designs; scan test data volume; scan test time; test data compression; test response compaction schemes; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Compaction; Copper; Costs; Design for testability; Test data compression; Test pattern generators;
Conference_Titel :
Computer Design, 2003. Proceedings. 21st International Conference on
Print_ISBN :
0-7695-2025-1
DOI :
10.1109/ICCD.2003.1240915