• DocumentCode
    2221213
  • Title

    Likelihood of acquisition by private equity fund in semiconductor packaging industry

  • Author

    Ho, C.T. ; Teng, H.C.

  • Author_Institution
    Dept. of Ind. Eng. & Manage., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    22
  • Lastpage
    25
  • Abstract
    One of the biggest news in Taiwan semiconductor industry between 2006 and 2007 is the proposed acquisition of Advanced Semiconductor Engineering (ASE) by private equity fund. Although the price-to-earnings ratio is probably the most widely known yardstick, Businessweek used a price-to-cash flow ratio as another valuation tool to measure the attractive under-valuated companies. However, among those under-valuated companies, ASE is the only company got the attention of private equity fund. We propose another value model, enterprise value and earnings before interest, taxes, depreciation and amortization, to measure the attractiveness of those companies to the private equity fund. This model was used on ASE case first to set the standard. The rest of the companies are also examined by the same model to check the validity of this model.
  • Keywords
    investment; packaging; pricing; semiconductor industry; Advanced Semiconductor Engineering; enterprise value model; price-to-cash flow ratio; price-to-earning ratio; private equity fund acquisition; semiconductor packaging industry; under-valuated company; Companies; Costs; Electronics industry; Engineering management; Finance; Fluid flow measurement; Industrial engineering; Integrated circuit packaging; Portfolios; Semiconductor device packaging; Fonts; formatting; margins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4737825
  • Filename
    4737825