DocumentCode
2221254
Title
Carbon nanostructure enhanced reinforcements in electromagnetic compatibility applications
Author
Hartman, David ; Claussen, Greg ; VanHouten, Desmond
Author_Institution
Owens Corning Sci. & Technol., Granville, OH, USA
fYear
2012
fDate
6-10 Aug. 2012
Firstpage
301
Lastpage
306
Abstract
Carbon enhanced reinforcements (CER) for multifunctional composite design were recently developed using technology where carbon nanostructures (CNS) are synthesized on the surface of glass fibers in a continuous, in-line, production scalable process. The hybrid reinforcement results in a highly conductive multifunctional capability in thermoset and thermoplastic resins that enables excellent electromagnetic interference (EMI) shielding performance. This paper discusses the development and industrialization of the carbon nanostructure-glass fiber hybrid pelletized in thermoplastic masterbatches of polycarbonate-acrylonitrile-butadiene-styrene (PC/ABS), polyamide-6,6 (PA-6,6), polycarbonate (PC), and polypropylene (PP). It reviews the electrical, thermal and mechanical properties of the compounds for engineered solutions in injection molded electromagnetic compatability (EMC) applications.
Keywords
electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; glass fibres; nanostructured materials; CER; CNS; EMC applications; EMI shielding performance; carbon nanostructure enhanced reinforcements; electrical properties; electromagnetic compatibility applications; electromagnetic interference shielding performance; glass fibers surface; hybrid reinforcement; injection molded electromagnetic compatability; mechanical properties; multifunctional composite design; polyamide-6,6; polycarbonate; polycarbonate-acrylonitrile-butadiene-styrene; polypropylene; production scalable process; thermal properties; thermoplastic masterbatches; thermoplastic resins; thermoset resins; Carbon dioxide; Conductivity; Electromagnetic interference; Loading; Materials; Optical fiber dispersion; Reflection;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location
Pittsburgh, PA
ISSN
2158-110X
Print_ISBN
978-1-4673-2061-0
Type
conf
DOI
10.1109/ISEMC.2012.6351832
Filename
6351832
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