Title :
Micromechanical model of a thin film intrafascicular electrode during insertion into peripheral nerves
Author :
Bossi, Silvia ; Sergi, Pier Nicola ; Micera, Silvestro
Author_Institution :
ARTS Lab., Scuola Superiore Sant´´Anna di Studi Universitari e di Perfezionamento (SSSA), Pisa, Italy
fDate :
April 29 2009-May 2 2009
Abstract :
In this paper a thin film intrafascicular interface has been modeled during the insertion procedure inside peripheral nerves using a theoretical approach and a FEM analysis. In particular, the aim was to investigate the effects of several characteristics of the intraneural interfaces (e.g., the interface width and Kevlar filament diameter) on the maximal Von Mises stress reached during implantation. The results were used to gather new guidelines to develop more reliable thin film interfaces with maximal success rate during the implantation phase.
Keywords :
bioMEMS; bioelectric phenomena; biomedical electrodes; finite element analysis; microelectrodes; neurophysiology; reliability; thin film devices; FEM analysis; Kevlar filament diameter; implantation phase; interface width; intraneural interface; maximal Von Mises stress; micromechanical model; peripheral nerves; reliable thin film intrafascicular electrode insertion; theoretical approach; Electrodes; Geometry; Guidelines; Micromechanical devices; Needles; Polyimides; Stress; Transistors; Tungsten; Wire; FEM analysis; Neural interface; insertion procedure; micromechanical sudy; peripheral nerve;
Conference_Titel :
Neural Engineering, 2009. NER '09. 4th International IEEE/EMBS Conference on
Conference_Location :
Antalya
Print_ISBN :
978-1-4244-2072-8
Electronic_ISBN :
978-1-4244-2073-5
DOI :
10.1109/NER.2009.5109244
