• DocumentCode
    2222286
  • Title

    A theory thermal growth control techniques of high speed spindles

  • Author

    Chang, Ching-Feng ; Chao, Ching-Yi ; Ling, Chao-Shi ; Chen, Jin-Jia ; Chen, Tsair-Rong

  • Author_Institution
    Dept. of Electr. Eng., Nat. Changhua Univ. of Educ., Taichung, Taiwan
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    247
  • Lastpage
    252
  • Abstract
    A motorized high speed spindle has very complicated dynamics consisting of non-stationary and speed-related thermal characteristics. Many studies have reported different designs to control or monitor thermal spindle growth with limited results, whereas the application of High Speed Machining (HSM) demands ¿zero tolerance¿ no matter the range of speed or material to be machined. This study will outline a direct displacement monitoring system that is capable of accurately monitoring and compensating for thermal growth associated with motorized high speed spindles. This system of monitoring and compensating is a considerable improvement compared to many take inaccurate readings through a traditional thermo coupler. The direct displacement measuring system, optimizing a high speed synchronous feedback system will meet the tolerance and performance expected in HSM applications. Based on the introduction of Foucault Current, a design for an accurate thermal growth is outlined.
  • Keywords
    eddy currents; machine tool spindles; machining; thermocouples; Foucault Current; High Speed Machining; direct displacement measuring system; high speed spindles; motorized spindle; synchronous feedback system; thermal growth control; thermocoupler; zero tolerance; Actuators; Chaos; Control engineering education; Machine tool spindles; Machining; Monitoring; Springs; Temperature; Thermal engineering; Thermal loading; Foucault current; HSM; motorized spindle; thermal growth; thermo coupler;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4737868
  • Filename
    4737868