• DocumentCode
    2222803
  • Title

    Scheduling on identical machines with batch arrivals in semiconductor testing house

  • Author

    Chung, T.P. ; Liao, C.J. ; Su, L.H.

  • Author_Institution
    Dept. of Ind. Manage., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    340
  • Lastpage
    344
  • Abstract
    In the scheduling literature, it is often assumed that jobs arrive either simultaneously or individually. However, this assumption is invalid in most practical situations because jobs usually arrive in batches, e.g., the final testing house in the manufacturing of semiconductor. The concept of batch arrivals has been mentioned in some studies, but it has not been explored from an operational viewpoint. This paper first addresses an identical parallel machine problem with batch arrivals to minimize the total completion time. Since the problem is NP-hard, a heuristic based on binary integer program is proposed. Computational results show that the proposed heuristic can efficiently obtain good solutions with an average percentage error of 0.41.
  • Keywords
    batch processing (industrial); computational complexity; optimisation; parallel machines; scheduling; semiconductor device testing; NP-hard problem; batch arrivals; batch arrivals concept; binary integer program; machine scheduling; parallel machine problem; semiconductor manufacturing; semiconductor testing house; Circuit testing; Engineering management; Industrial engineering; Job shop scheduling; Parallel machines; Processor scheduling; Production facilities; Semiconductor device manufacture; Semiconductor device testing; Technology management; Batch arrivals; branch and bound algorithm; identical parallel machines; semiconductor scheduling; total completion time;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4737887
  • Filename
    4737887