DocumentCode :
2224287
Title :
VLSI placement with pre-placed modules based on less flexibility first principles
Author :
Dong, Sheqin ; Hong, Xianlong ; Wu, Yuliang ; Xiu, Zhong ; Gu, Jun
Author_Institution :
Dept. of Comput. Sci., Tsinghua Univ., Beijing, China
fYear :
2001
fDate :
2001
Firstpage :
106
Lastpage :
109
Abstract :
The locations of ROM, RAM, and CPU often were required to fix a priori while other modules are subject to be placed in the rest of the chip area. These situations were formulated as placement with pre-placed modules. Rectilinear substrate and holes of the substrate can be also modeled with the use of pre-placed modules. Unlike the coding scheme based stochastic optimization placement algorithms, which need special feasible checking of the representation for placement with pre-placed modules, we develop a new deterministic algorithm to cope with the same problem. The placement area is evaluated first. Then the flexibility of each placement module is calculated according to its packing location, size and connectivity among other neighbor modules. According to the less flexibility first principle, the placement is completed through a recursive packing process. Pre-placed modules just form the placement area, no extra calculation is needed. Experiment results show our algorithm is better than stochastic algorithm
Keywords :
VLSI; circuit layout CAD; circuit optimisation; deterministic algorithms; integrated circuit layout; VLSI placement; design optimization; deterministic algorithm; less flexibility first principle; pre-placed modules; recursive packing process; Central Processing Unit; Chip scale packaging; Computer science; NP-hard problem; Pins; Printed circuits; Read only memory; Read-write memory; Stochastic processes; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC, 2001. Proceedings. 4th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6677-8
Type :
conf
DOI :
10.1109/ICASIC.2001.982509
Filename :
982509
Link To Document :
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