DocumentCode :
2224983
Title :
A low-power and high-frequency CMOS transceiver for chip-to-chip interconnection
Author :
Liu, Wei-Jean ; Sheen, Robin R B ; Hwang, Jen-Shang ; Chen, Oscal T C
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan
Volume :
3
fYear :
2000
fDate :
2000
Firstpage :
1
Abstract :
In this paper, we developed a low-power and high-frequency transceiver by using the TSMC 0.35 um CMOS single-poly-four-metal technology. The proposed transceiver includes a photo-detector and a laser diode driver where the photodiode and laser diode can be packaged by using the flip-chip connections. The proposed photo-detector indirectly senses the photo current and uses a bias voltage to control a current source and to provide an adequate reversed bias voltage of the photodiode. The laser diode driver is implemented by using a current mirror and two gate-control transistors. A prototype chip of two 2×2 receivers and two 2×2 transmitters are implemented with a die size of 2.4 mm×2.4 mm where the CMOS photodiodes with ring-type electrodes are designed. At a supply voltage of 3.3 V, the proposed photo-detector and laser diode driver can be operated at a clock frequency of 1 GHz with power dissipation of 3.8 mW and 5.0 mW, respectively, where the photodiode provides 100 μA and the laser diode has a threshold current of 0.6 mA for a light wavelength of 850 nm. Therefore, the proposed transceiver can be widely used in low-power and high-frequency chip-to-chip interconnection systems
Keywords :
CMOS integrated circuits; VLSI; current mirrors; driver circuits; flip-chip devices; integrated circuit interconnections; optical transmitters; photodetectors; transceivers; 0.35 micron; 0.6 mA; 1 GHz; 100 muA; 3.3 V; 3.8 mW; 5.0 mW; 850 nm; CMOS single-poly-four-metal technology; chip-to-chip interconnection; chip-to-chip interconnection systems; clock frequency; current mirror; flip-chip connections; gate-control transistors; high-frequency CMOS transceiver; laser diode driver; photo-detector; power dissipation; reversed bias voltage; ring-type electrodes; threshold current; CMOS technology; Diode lasers; Driver circuits; Mirrors; Packaging; Photodiodes; Prototypes; Transceivers; Transmitters; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location :
Geneva
Print_ISBN :
0-7803-5482-6
Type :
conf
DOI :
10.1109/ISCAS.2000.855980
Filename :
855980
Link To Document :
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