• DocumentCode
    2225063
  • Title

    New model and hybrid genetic algorithm for component placement of multi-head gantry mount machine

  • Author

    Du, Xuan ; Li, Zongbin

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xian Jiaotong Univ., Xian, China
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    790
  • Lastpage
    794
  • Abstract
    The mechanism and placement process of multi-head gantry mount machine (MHGM) is analyzed. Based on the engineering analysis, the optimization problem of placement process is decomposed to component grouping, component group pickup and component group placement problems, an integrated optimization model of MHGM is formulated, the minimum displacement of arm is objective. The component size, nozzle change and different component arrangement strategy in slots is considered. Combined with heuristic method and genetic algorithm (GA), a hybrid GA (HGA) is adopted to optimize the placement process. In the individual chromosome, the feeder index and slot index describe the arrangement sequence and position of component types in the slot. The HGA use improved order crossover, adaptive mutation and local search and contains a parallel structure. The component placement sequence and the feeder arrangement are optimized simultaneously to improve the assembly efficiency.
  • Keywords
    assembling; genetic algorithms; printed circuit manufacture; surface mount technology; component placement; feeder index; heuristic method; hybrid genetic algorithm; multi-head gantry mount machine; optimization; slot index; Assembly; Genetic algorithms; Laboratories; Magnetic heads; Manufacturing systems; Optimization methods; Printed circuits; Surface-mount technology; Systems engineering and theory; Traveling salesman problems; Genetic Algorithm; Multi-head gantry mount machine; Optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4737978
  • Filename
    4737978