• DocumentCode
    2226672
  • Title

    Reliability issues for high performance nanoscale CMOS technologies with channel mobility enhancing schemes

  • Author

    Chung, Steve S.

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu
  • fYear
    2006
  • fDate
    Jan. 30 2006-Feb. 1 2006
  • Firstpage
    128
  • Lastpage
    131
  • Abstract
    In this talk, an overview of the mobility enhancing techniques for high performance/low power CMOS technologies will be introduced first. Two categories for mobility enhancing schemes, channel induced strain using Si/SiGe, and hybrid-substrate engineering, with (100) and (110) orientations, will be discussed next. In terms of the device reliability, different mechanisms.. are responsible for these two different technologies. While we have paid much more attention on the performance of these technologies, the device reliability has not been taken care of in the past studies. As a consequence, this talk will address several examples of these mobility enhancing schemes and their impact on the device reliability for advanced CMOS technologies for 65 nm and beyond.
  • Keywords
    CMOS integrated circuits; Ge-Si alloys; MOSFET; elemental semiconductors; integrated circuit reliability; internal stresses; nanoelectronics; semiconductor device reliability; silicon; (100) substrate orientation; (110) substrate orientation; MOSFET; Si-SiGe; channel induced strain; channel mobility enhancing techniques; device reliability; hybrid-substrate engineering; nanoscale CMOS technology; size 65 nm; CMOS technology; Capacitive sensors; Degradation; Germanium silicon alloys; MOS devices; MOSFET circuits; Power engineering and energy; Reliability engineering; Silicon germanium; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano CMOS, 2006 International Workshop on
  • Conference_Location
    Mishima
  • Print_ISBN
    978-1-4244-0603-6
  • Type

    conf

  • DOI
    10.1109/IWNC.2006.4570983
  • Filename
    4570983