• DocumentCode
    2226949
  • Title

    Investigation of a high-current pulsed magnetron discharge initiated in the low-pressure diffuse arc plasma

  • Author

    Bugaev, S.P. ; Koval, N.N. ; Sochugov, N.S. ; Zakharov, A.N.

  • Author_Institution
    Inst. of High-Current Electron., Acad. of Sci., Tomsk, Russia
  • Volume
    2
  • fYear
    1996
  • fDate
    21-26 Jul 1996
  • Firstpage
    1074
  • Abstract
    The paper presents the results of a study of a pulsed high-current magnetron discharge used for deposition of thin metallic films. The current-voltage characteristic of this type of discharge and its range of occurence have been investigated in relation to the magnetic field induction, the cathode material and the preionization plasma density. High-frequency oscillations of the voltage across the magnetron sputtering system caused by the repetitive variation in the conductance of the cathode-anode gap have been discovered. The achieved pulsed deposition rate for copper is 11 μm/min
  • Keywords
    copper; electric breakdown; magnetrons; metallic thin films; plasma density; plasma deposited coatings; plasma deposition; sputter deposition; sputtered coatings; vacuum arcs; vacuum breakdown; vacuum insulation; Cu; HF voltage oscillations; cathode material; cathode-anode gap conductance; high-current pulsed magnetron discharge; low-pressure diffuse arc plasma; magnetic field induction; magnetron sputtering; preionization plasma density; pulsed deposition rate; thin metallic film deposition; Cathodes; Conducting materials; Copper; Current-voltage characteristics; Magnetic fields; Magnetic films; Magnetic materials; Plasma density; Sputtering; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7803-2906-6
  • Type

    conf

  • DOI
    10.1109/DEIV.1996.545530
  • Filename
    545530