DocumentCode :
2227342
Title :
Sensitivity of interconnect delay to on-chip inductance
Author :
Ismail, Yehea I. ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Volume :
3
fYear :
2000
fDate :
2000
Firstpage :
403
Abstract :
Inductance extraction has become an important issue in the design of high speed CMOS circuits. Two characteristics of on-chip inductance are discussed in this paper that can significantly simplify the extraction of on-chip inductance, The first characteristic is that the sensitivity of a signal waveform to errors in the inductance values is low, particularly the propagation delay and the rise time. It is quantitatively shown in this paper that the error in the propagation delay and rise time is below 9.4% and 5.9%, respectively, assuming a 30% relative error in the extracted inductance. If an RC model is used for the same example, the corresponding errors are 51% and 71%, respectively, The second characteristic is that the magnitude of the on-chip inductance is a slowly varying function of the width of a wire and the geometry of the surrounding wires. These two characteristics can be exploited by using simplified techniques that permit approximate and sufficiently accurate values of the on-chip inductance to be determined with high computational efficiency
Keywords :
CMOS digital integrated circuits; delay estimation; equivalent circuits; error analysis; high-speed integrated circuits; inductance; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; sensitivity analysis; RC model; errors; high speed CMOS circuits; inductance extraction; interconnect delay sensitivity; onchip inductance; propagation delay; rise time; wire geometry; wire width; Capacitance; Clocks; Computational efficiency; Dielectric materials; Geometry; Inductance; Integrated circuit interconnections; Propagation delay; Substrates; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location :
Geneva
Print_ISBN :
0-7803-5482-6
Type :
conf
DOI :
10.1109/ISCAS.2000.856082
Filename :
856082
Link To Document :
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