Title :
Chip-scale multiple quantum well based optical interconnects
Author :
Nair, Rohit ; Gu, Tian ; Teitelbaum, Michael E. ; Goossen, Keith W. ; Kiamilev, Fouad ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
Hybrid integration of multiple quantum well modulators with silicon is proposed for implementing chip-scale optical interconnects. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices.
Keywords :
CMOS integrated circuits; III-V semiconductors; aluminium compounds; gallium arsenide; hybrid integrated circuits; integrated circuit interconnections; optical interconnections; optical modulation; optical polymers; optical waveguides; quantum well devices; GaAs-AlAs; Si; chip scale multiple quantum well; hybrid integration; multiple quantum well modulator; optical interconnects; polymer waveguides; Couplings; Fabrics; Gallium arsenide; Optical device fabrication; Optical interconnections; Optical waveguides; Quantum well devices;
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2011 Conference on
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4577-1223-4
