Package and interconnect modeling of the HFA3624, a 2.4 GHz RF to IF converter

Author

Kamon, Mattan ; Majors, Steve S.

Author_Institution

Res. Lab. of Electron., MIT, Cambridge, MA, USA

fYear

1996

fDate

3-7 Jun, 1996

Firstpage

2

Lastpage

7

Abstract

This paper demonstrates the use of three-dimensional electromagnetic field solvers to accurately model the interconnect for a 2.4 GHz RF to IF converter integrated circuit under development at Harris Semiconductor. Lumped element RLC models for the package leads, bondwires, die attach plane, and on-chip interconnect are shown to provide accurate simulation versus measurement and prove the importance of modeling the entire packaged IC

Keywords

UHF frequency convertors; UHF integrated circuits; bipolar analogue integrated circuits; inductance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; lead bonding; lumped parameter networks; 2.4 GHz; 2.4 GHz RF to IF converter integrated circuit; HFA3624; bondwires; die attach plane; interconnect modeling; lumped element RLC models; on-chip interconnect; package leads; three-dimensional electromagnetic field solvers; Bonding; Electromagnetic fields; Electromagnetic modeling; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Lead; Radio frequency; Radiofrequency integrated circuits; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference Proceedings 1996, 33rd

Conference_Location

Las Vegas, NV

ISSN

0738-100X

Print_ISBN

0-7803-3294-6

Type

conf

DOI

10.1109/DAC.1996.545535

Filename

545535