• DocumentCode
    2228671
  • Title

    Solid-state microsensors and smart structures

  • Author

    Najafi, Khalil ; Mastrangelo, Carlos H.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI
  • fYear
    1993
  • fDate
    31 Oct-3 Nov 1993
  • Firstpage
    341
  • Abstract
    Solid-state microsensors have been recently developed for the measurement of a number of physical and chemical parameters for use in today´s instrumentation and control systems. This paper reviews the state-of-the-art in the development of silicon micromachining technologies for the fabrication of silicon microsensors. Micromachining technologies such as bulk silicon micromachining, surface micromachining, and electroplating techniques are first reviewed, followed by a discussion of various thin-film materials used in the implementation of required microstructures. Several examples of silicon microsensors, including a 1024-element silicon tactile imager, and a thermally-based pressure and flow sensor, are presented. Finally, a discussion of potential use of these devices in smart structures and systems is presented
  • Keywords
    electric sensing devices; electroplating; flow measurement; flowmeters; image sensors; integrated circuit technology; intelligent structures; machining; micromechanical devices; pressure sensors; semiconductor device manufacture; silicon; surface treatment; tactile sensors; Si; Si micromachining technologies; Si microsensors; Si tactile imager; bulk Si micromachining; electroplating; fabrication; flow sensor; pressure sensor; smart structures; surface micromachining; Chemical technology; Control systems; Fabrication; Instruments; Intelligent structures; Micromachining; Microsensors; Semiconductor thin films; Silicon; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1993.339471
  • Filename
    339471