DocumentCode
2228671
Title
Solid-state microsensors and smart structures
Author
Najafi, Khalil ; Mastrangelo, Carlos H.
Author_Institution
Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI
fYear
1993
fDate
31 Oct-3 Nov 1993
Firstpage
341
Abstract
Solid-state microsensors have been recently developed for the measurement of a number of physical and chemical parameters for use in today´s instrumentation and control systems. This paper reviews the state-of-the-art in the development of silicon micromachining technologies for the fabrication of silicon microsensors. Micromachining technologies such as bulk silicon micromachining, surface micromachining, and electroplating techniques are first reviewed, followed by a discussion of various thin-film materials used in the implementation of required microstructures. Several examples of silicon microsensors, including a 1024-element silicon tactile imager, and a thermally-based pressure and flow sensor, are presented. Finally, a discussion of potential use of these devices in smart structures and systems is presented
Keywords
electric sensing devices; electroplating; flow measurement; flowmeters; image sensors; integrated circuit technology; intelligent structures; machining; micromechanical devices; pressure sensors; semiconductor device manufacture; silicon; surface treatment; tactile sensors; Si; Si micromachining technologies; Si microsensors; Si tactile imager; bulk Si micromachining; electroplating; fabrication; flow sensor; pressure sensor; smart structures; surface micromachining; Chemical technology; Control systems; Fabrication; Instruments; Intelligent structures; Micromachining; Microsensors; Semiconductor thin films; Silicon; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
Conference_Location
Baltimore, MD
Print_ISBN
0-7803-2012-3
Type
conf
DOI
10.1109/ULTSYM.1993.339471
Filename
339471
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