Title :
An electromagnetic technique for packaging problem analysis
Author :
Krause, K.E. ; Spielman, B.E.
Author_Institution :
Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
Abstract :
A new three-dimensional electromagnetic packaging analysis is developed for shielded configurations containing arbitrarily shaped, homogeneous, isotropic regions. Computer implementation uses and extends routines from a computational engine for electromagnetic scattering. The packaging analysis is validated using rectangular waveguide configurations. Preliminary analysis is performed on a filtering structure.
Keywords :
computer aided analysis; electrical engineering computing; electromagnetic shielding; electromagnetic wave scattering; packaging; rectangular waveguides; waveguide theory; 3D electromagnetic packaging analysis; EM scattering computational engine; electromagnetic technique; filtering structure; packaging problem analysis; rectangular waveguide configurations; shielded configurations; three-dimensional electromagnetic analysis; Boundary conditions; Electric variables measurement; Electromagnetic analysis; Electromagnetic measurements; Electromagnetic scattering; Equations; Geometry; Packaging; Reflection; Writing;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.511214
