• DocumentCode
    2230720
  • Title

    Cost-effective delay-insensitive data transfer mechanism using current-mode multiple valued logic

  • Author

    Oh, Myeong-Hoon ; Paek, Dong-Geun ; Jung, Eun-Gu ; Lee, Dong-Ik

  • Author_Institution
    Dept. of Inf. & Commun., Kwang-Ju Inst. of Sci. & Technol., Gwangju, South Korea
  • fYear
    2003
  • fDate
    17-20 Sept. 2003
  • Firstpage
    151
  • Lastpage
    154
  • Abstract
    In this paper, we propose a new data transfer mechanism based on delay-insensitive (DI) data coding with current-mode multiple valued logic (CMMVL). In previous DI data coding, the number of required wires for transferring N-bit data is 2N+1. However, only N+1 wires are needed in our transfer mechanism so it can contribute greatly to reducing the wire cost for designing a large scaled chip. We compare the proposed CMMVL circuit with conventional dual-rail DI encoding to validate its effectiveness through simulation in 0.25 μm CMOS technology. In addition to advantage in wire cost, for 32 bit data transfer, simulation results show that the MVL version is superior to the dual-rail version by about 24.9% in the metric of time-power product. We also apply the MVL version to a practical environment such as an asynchronous bus architecture.
  • Keywords
    CMOS logic circuits; current-mode logic; encoding; integrated circuit design; integrated circuit interconnections; logic design; logic simulation; multivalued logic circuits; system buses; 0.25 micron; 32 bit; CMMVL; CMOS technology; DI data coding; asynchronous bus architecture; cost-effective data transfer; current-mode multiple valued logic; data transfer wire number requirement; delay-insensitive data transfer mechanism; dual-rail DI encoding; global interconnection scheme; time-power product; wire cost reduction; CMOS technology; Circuit simulation; Costs; Delay estimation; Encoding; Integrated circuit interconnections; Multivalued logic; Protocols; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
  • Print_ISBN
    0-7803-8182-3
  • Type

    conf

  • DOI
    10.1109/SOC.2003.1241482
  • Filename
    1241482