• DocumentCode
    2230902
  • Title

    Tile-based power planning during floorplanning

  • Author

    Fang, Jyh Pern ; Chen, Sao Jie

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2003
  • fDate
    17-20 Sept. 2003
  • Firstpage
    195
  • Lastpage
    198
  • Abstract
    In this paper, we introduce a tile-based approach to power planning at the stage of floorplanning. For a given floorplan solution, an associated tile graph of power density is generated, and the temperature of the floorplan is evaluated tile by tile. In contrast to the direct evaluation from the power consumption of circuit blocks and neglecting the effect of heat diffusion, we take the effect of heat diffusion in a die into consideration. Also, we simplify the computing of temperature by way of a tile graph, which make the heat estimation and thus the power planning in the floorplanning stage possible.
  • Keywords
    integrated circuit layout; thermal analysis; thermal diffusion; thermal management (packaging); die heat diffusion; floorplanning; heat estimation; hot spots; power density tile graph; temperature computation; thermal analysis; tile-based power planning; Bismuth; Circuits; Clocks; Energy consumption; Piecewise linear approximation; Power engineering and energy; Power generation; Temperature; Tiles; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
  • Print_ISBN
    0-7803-8182-3
  • Type

    conf

  • DOI
    10.1109/SOC.2003.1241491
  • Filename
    1241491