DocumentCode
2230902
Title
Tile-based power planning during floorplanning
Author
Fang, Jyh Pern ; Chen, Sao Jie
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2003
fDate
17-20 Sept. 2003
Firstpage
195
Lastpage
198
Abstract
In this paper, we introduce a tile-based approach to power planning at the stage of floorplanning. For a given floorplan solution, an associated tile graph of power density is generated, and the temperature of the floorplan is evaluated tile by tile. In contrast to the direct evaluation from the power consumption of circuit blocks and neglecting the effect of heat diffusion, we take the effect of heat diffusion in a die into consideration. Also, we simplify the computing of temperature by way of a tile graph, which make the heat estimation and thus the power planning in the floorplanning stage possible.
Keywords
integrated circuit layout; thermal analysis; thermal diffusion; thermal management (packaging); die heat diffusion; floorplanning; heat estimation; hot spots; power density tile graph; temperature computation; thermal analysis; tile-based power planning; Bismuth; Circuits; Clocks; Energy consumption; Piecewise linear approximation; Power engineering and energy; Power generation; Temperature; Tiles; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
Print_ISBN
0-7803-8182-3
Type
conf
DOI
10.1109/SOC.2003.1241491
Filename
1241491
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