• DocumentCode
    2231318
  • Title

    Design and fabrication of a micromirror using silicon bulk micromachining for out-of-plane right angle reflection

  • Author

    Yun-Ho Jang ; Yong-Kweon Kim

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
  • fYear
    2002
  • fDate
    20-23 Aug. 2002
  • Firstpage
    79
  • Lastpage
    80
  • Abstract
    A matter of prime importance in silicon micromirror fabrication is how to get a silicon mirror plate under structure and fabrication restrictions. Deep silicon etch, silicon-glass anodic bonding and thinning process are used in this research for a silicon mirror plate. This approach offers a flat silicon mirror plate and the thickness of a silicon plate can be thinned up to 25 /spl mu/m. The micromirror should rotate with 45 degrees for out-of-plane right angle reflection. Therefore it is difficult to use stiff materials as a torsional spring. Aluminum is a good candidate for such a large angular motion though its residual stress may also affect operation performances.
  • Keywords
    elemental semiconductors; etching; micromachining; micromirrors; optical fabrication; silicon; wafer bonding; Al; Si; aluminum torsional spring; deep silicon etching; out-of-plane right angle reflection; silicon bulk micromachining; silicon micromirror fabrication; silicon mirror plate; silicon-glass anodic bonding; thinning process; Aluminum; Bonding; Etching; Fabrication; Micromachining; Micromirrors; Mirrors; Reflection; Silicon; Springs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical MEMs, 2002. Conference Digest. 2002 IEEE/LEOS International Conference on
  • Conference_Location
    Lugano, Switzerland
  • Print_ISBN
    0-7803-7595-5
  • Type

    conf

  • DOI
    10.1109/OMEMS.2002.1031452
  • Filename
    1031452