A low power open multimedia application platform for 3G wireless

Author

Song, James ; Shepherd, Thomas ; Chau, Minh ; Huq, Ayesha ; Syed, Ikram ; Roy, Somdipta ; Thippana, Achuta ; Shi, Kaijian ; Ko, Uming

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

2003

fDate

17-20 Sept. 2003

Firstpage

377

Lastpage

380

Abstract

This paper describes an SOC design of a complex, low power and high performance open multimedia application platform (OMAP^TM) for 3G wireless. The design integrates a high performance DSP subsystem based on a low power TMS320C55x DSP and an MPU subsystem based on the ARM9 microprocessor for the optimal combination of high performance with low power consumption. This paper explains the system design and the SoC implementations of the platform.

Keywords

3G mobile communication; digital signal processing chips; integrated circuit design; logic design; low-power electronics; multimedia communication; system-on-chip; 3G wireless; ARM9 microprocessor; MPU subsystem; OMAP; SOC; TMS320C55x DSP; high performance DSP subsystem; low power dual core architecture; open multimedia application platform; Computer architecture; Control systems; Digital audio players; Digital signal processing; Digital signal processing chips; Energy consumption; Home appliances; Instruments; Microprocessors; Videoconference;

fLanguage

English

Publisher

ieee

Conference_Titel

SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]

Print_ISBN

0-7803-8182-3

Type

conf

DOI

10.1109/SOC.2003.1241547

Filename

1241547