• DocumentCode
    2232318
  • Title

    Performance analysis of cluster based 3D routing algorithms for NoC

  • Author

    Viswanathan, N. ; Paramasivam, K. ; Somasundaram, K.

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Mahendra Eng. Coll., Namakkal, India
  • fYear
    2011
  • fDate
    22-24 Sept. 2011
  • Firstpage
    157
  • Lastpage
    162
  • Abstract
    In the nano scaled transistors integration era, interconnection of IP blocks and data exchange among the IP blocks are crucial concerns in System on Chip (SoC). Network-on-Chip (NoC) is an on-chip communication methodology proposed to resolve the increased interconnection problems in SoC. In deep sub-micron regime, 3D NoC becomes an emerging research area in recent years as the three dimensional (3D) integrated circuits (ICs) can offer shorter interconnection wire and dissipate lesser power. Major area of the 3D NoC research is network topology and routing techniques. In this paper, we present an NS-2 (Network Simulator) simulation environment for two 3D network topologies (GBT and CBT) and cluster based routing algorithms. Simulation results are reported. Simulation results about the relationship between switch buffer size, injected traffic load, packet delay, packet drop probability and energy dissipation are analyzed. On comparing CBT with GBT, a significant performance improvement is demonstrated.
  • Keywords
    integrated circuit interconnections; network routing; network-on-chip; probability; three-dimensional integrated circuits; 3D NoC research; 3D network topology; 3D routing algorithms; Network Simulator; cluster analysis; cluster based routing algorithms; deep sub-micron regime; energy dissipation; injected traffic load; interconnection problems; interconnection wire; network topology; network-on-chip; on-chip communication methodology; packet delay; packet drop probability; routing techniques; switch buffer size; three dimensional integrated circuits; Network topology; Routing; Switches; Telecommunication traffic; Three dimensional displays; Topology; Wires; 3D topology; NoC; SoC; delay; drop probability; latency; routing; switch buffer size;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Recent Advances in Intelligent Computational Systems (RAICS), 2011 IEEE
  • Conference_Location
    Trivandrum
  • Print_ISBN
    978-1-4244-9478-1
  • Type

    conf

  • DOI
    10.1109/RAICS.2011.6069293
  • Filename
    6069293