DocumentCode :
2232509
Title :
A high-rel embedded ferroelectric memory
Author :
Kamp, D.A. ; DeVilbiss, Alan D.
Author_Institution :
Celis Semicond. Corp., Colorado Springs
fYear :
2007
fDate :
10-13 Nov. 2007
Firstpage :
56
Lastpage :
59
Abstract :
An 8 Kbit ferroelectric nonvolatile memory (FeRAM) has been designed and fabricated for embedded memory applications requiring high reliability operation such as space and radio frequency identification (RFID). It features a wide operating supply range of 2.7-3.6 V, operating temperature range of -60°C to +125°C, and robust memory cell data protection. The memory write and read cycle time is programmable to as short as 90 ns with an access time of 60 ns. Typical power consumption per cycle is 7.6 mW. Energy consumption per cycle is 0.94 nJ. The silicon area used is 0.28 mm2 for 0.35 μm design rules.
Keywords :
embedded systems; ferroelectric storage; integrated circuit design; integrated circuit reliability; random-access storage; secure storage; FeRAM; RFID; energy 0.94 J; energy consumption; ferroelectric nonvolatile memory design; high-rel embedded ferroelectric memory applications; memory cell data protection; memory write-and-read cycle time; power 7.6 mW; power consumption; radio frequency identification; reliability operation; silicon area; size 0.35 mum; temperature -60 C to 125 C; voltage 2.7 V to 3.6 V; Energy consumption; Ferroelectric films; Ferroelectric materials; Nonvolatile memory; Protection; Radiofrequency identification; Random access memory; Read-write memory; Robustness; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Non-Volatile Memory Technology Symposium, 2007. NVMTS '07
Conference_Location :
Albuquerque, NM
Print_ISBN :
978-1-4244-1361-4
Type :
conf
DOI :
10.1109/NVMT.2007.4389946
Filename :
4389946
Link To Document :
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