• DocumentCode
    2233111
  • Title

    Environmentally-Friendly Nano-fluid Minimum Quantity Lubrication (MQL) Meso-scale Grinding Process Using Nano-diamond Particles

  • Author

    Lee, Pil-Ho ; Nam, Taek Soo ; Li, Chengjun ; Lee, Sang Won

  • Author_Institution
    Dept. of Mech. Eng., Sungkyunkwan Univ., Suwon, South Korea
  • fYear
    2010
  • fDate
    13-15 Dec. 2010
  • Firstpage
    44
  • Lastpage
    49
  • Abstract
    To reduce environmental loads caused by full usage of cutting fluids, nano-fluids, mixtures of nano-scale particles and base fluids, have recently been applied to mechanical machining processes with minimum quantity lubrication (MQL) approach. This paper discusses the characteristics of nano-fluid MQL meso-scale grinding process in the miniaturized machine tool system that can significantly save energy and cost. Nano-diamond particles and paraffin oil are used for nano-fluid, and a series of nano-fluid MQL meso-scale grinding experiments are carried out. The experimental results show that nano-fluid MQL approach can significantly reduce grinding forces and surface roughness when compared with dry and pure MQL cases. In addition, smaller nano-diamond particles can be more beneficial to produce better ground surfaces.
  • Keywords
    cutting; grinding; lubrication; cutting fluids; environmental loads; environmentally-friendly nanofluid minimum quantity lubrication; mesoscale grinding process; miniaturized machine tool system; nanodiamond particles; nanofluid MQL meso-scale grinding process; nanofluids; nanoscale particles; paraffin oil; Environmentally-friendly machining; Meso-scale grinding; Miniaturized machine tool system; Minimum quantity lubrication (MQL); Nano-diamond; Nanofluid; Signal processing systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Manufacturing Automation (ICMA), 2010 International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-9018-9
  • Electronic_ISBN
    978-0-7695-4293-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2010.27
  • Filename
    5695154