• DocumentCode
    2233282
  • Title

    Equipment characterization and integration building a foundation for quality

  • Author

    Davis, Guy ; Symula, Terry

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    1996
  • fDate
    12-14 Nov 1996
  • Firstpage
    80
  • Abstract
    Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment´s communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment´s CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together
  • Keywords
    computer integrated manufacturing; semiconductor device manufacture; Motorola; SEMI standards; communication interface; computer integrated manufacturing; cost of ownership; cycle time; equipment integration; productivity; quality; semiconductor fab; software tools; yield; Computer aided manufacturing; Computer integrated manufacturing; Cost function; Helium; Production facilities; Productivity; Semiconductor device manufacture; Software quality; Software standards; Software tools;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-3371-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1996.557976
  • Filename
    557976