• DocumentCode
    22334
  • Title

    4 A x 10 Gbit/s full-duplex optical link with compact optical sub-assemblies and thin GI 50/125 plastic optical fibre ribbon

  • Author

    Schlepple, N. ; Nishigaki, Masakatsu ; Uemura, Hitoshi ; Furuyama, H. ; Sugizaki, Yoshiaki ; Shibata, Hajime ; Koike, Yasuharu

  • Author_Institution
    Semicond. & Storage Products Co., Toshiba Corp., Yokohama, Japan
  • Volume
    49
  • Issue
    13
  • fYear
    2013
  • fDate
    June 20 2013
  • Firstpage
    835
  • Lastpage
    836
  • Abstract
    A full-duplex data link at 10 Gbit/s per channel (two upstream and two downstream) between two compact bidirectional optical sub-assemblies is presented. Each sub-assembly is based on the authors´ optoelectronic ferrule and carries both laser diodes and photodiodes while maintaining a compact form factor of less than 20 mm3. The authors use plastic optical fibres with 50 μm graded-index cores and thin 125 μm claddings bundled in a four-channel ribbon but split the ribbon in order to reach both laser diodes and photodiodes within the optoelectronic ferrule, hence directly butt-coupling each channel with its own optical fibre. This method keeps both assembly form factor and complexity at a minimum and performance high. Eventually error-free signal transmission at 10 Gbit/s per channel over 5 m with 0.67 unit intervals eye opening is confirmed.
  • Keywords
    gradient index optics; integrated optoelectronics; optical communication equipment; optical fibre cladding; optical fibre networks; optical links; optical polymers; photodiodes; plastics; semiconductor lasers; telecommunication channels; assembly form complexity; assembly form factor; bit rate 10 Gbit/s; compact bidirectional optical subassemblies; compact form factor; direct butt-coupling; downstream channel; error-free signal transmission; eye opening; four-channel ribbon; full-duplex optical data link; graded-index cores; laser diodes; optoelectronic ferrule; photodiodes; size 125 mum; size 50 mum; thin GI plastic optical fibre ribbon; thin claddings; upstream channel;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2013.0583
  • Filename
    6553047