Title :
Recrystallization of the copper bottom electrode during complex oxide deposition onto kapton films
Author :
Suchaneck, G. ; Hubicka, Z. ; Levin, A.A. ; Günther, S. ; Cada, M. ; Dejneka, A. ; Jastrabik, L. ; Meyer, D.C. ; Schultheiss, E. ; Gerlach, G.
Author_Institution :
Solid Electron. Lab., Tech. Univ. Dresden, Dresden, Germany
Abstract :
In this work, we investigate for the first time the influence of complex oxide film deposition onto copper-coated polymer foils comprising a TiN seed layer on the microstructure of the underlaying randomly oriented copper film by means of wide-angle X-ray diffraction. Evidence of Cu crystallite size growth is given which is accompanied by an increase of Cu scattering crystalline volume. The final size of the copper crystallites depends on composition and microstructure of the ceramic oxide film.
Keywords :
X-ray diffraction; ceramics; crystallites; electrodes; metallic thin films; polymer films; recrystallisation; sputter deposition; DC sputtering; TiN-Cu; ceramic oxide film; complex oxide film deposition; copper bottom electrode; copper film; copper-coated polymer foils; crystallite size growth; kapton films; microstructure; recrystallization; wide-angle X-ray diffraction; Cathodes; Copper; Electrodes; Lattices; Piezoelectric films; Polymer films; Radio frequency; Sputtering; Substrates; Tin;
Conference_Titel :
Applications of Ferroelectrics, 2009. ISAF 2009. 18th IEEE International Symposium on the
Conference_Location :
Xian
Print_ISBN :
978-1-4244-4970-5
Electronic_ISBN :
1099-4734
DOI :
10.1109/ISAF.2009.5307558
