• DocumentCode
    2233658
  • Title

    A bulk micromachined silicon angular rate sensor

  • Author

    Kuisma, Heikki ; Ryhänen, Tapani ; Lahdenperä, Juha ; Punkka, Ero ; Ruotsalainen, Semi ; Sillanpaa, T. ; Seppä, Heikki

  • Author_Institution
    VTI Hamlin OY, Helsinki, Finland
  • Volume
    2
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    875
  • Abstract
    We describe an angular rate sensor based on bulk micro-machining of silicon. A silicon beam suspended on two sets of torsion springs has two orthogonal degrees of freedom for angular motion. The Coriolis force induced by external rotation modulates the coupling between the two modes which is then converted to a voltage output by an electro mechanical system operating at the mechanical resonance frequency. The sensor has unique silicon-glass sandwich structures for contacting the electrodes used for electrostatic excitation and capacitive detection within a hermetically enclosed space. The mechanical resonance frequencies are matched by adjusting the effective spring rate with an electrostatic field. The sensor is intended to be used in an automotive control system
  • Keywords
    angular velocity measurement; automotive electronics; electric sensing devices; elemental semiconductors; micromachining; microsensors; silicon; Coriolis force; Si; Si angular rate sensor; Si glass sandwich structures; angular motion; automotive control system; bulk micro-machining; capacitive detection; coupling; effective spring rate; electro mechanical system; electrostatic excitation; electrostatic field; external rotation; hermetically enclosed space; mechanical resonance frequencies; mechanical resonance frequency; torsion springs; Electrostatics; Force sensors; Mechanical sensors; Mechanical systems; Resonance; Resonant frequency; Sensor phenomena and characterization; Silicon; Springs; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.635241
  • Filename
    635241