128×128 3D-MEMS optical switch module with simultaneous optical paths connection for optical cross-connect systems

Author

Mizukami, M. ; Yamaguchi, J. ; Nemoto, N. ; Kawajiri, Y. ; Hirata, H. ; Uchiyama, S. ; Makihara, M. ; Sakata, T. ; Shimoyama, N. ; Ishii, H. ; Shimokawa, F.

Author_Institution

NTT Microsyst. Integration Labs., Nippon Telegraph & Telephone Corp., Atsugi, Japan

fYear

2009

fDate

15-19 Sept. 2009

Firstpage

1

Lastpage

2

Abstract

A 128times128 3D-MEMS optical switch module has been developed. A prototype switch module enables the simultaneous switching of all optical paths. The insertion loss is less than 4.8 dB and 2.6 dB on average. Regarding environmental characteristics, we confirmed that the module operates flawlessly when temperature in the installation room changes from -5 to 50degC. We also confirmed that the switching module satisfies the Telcordia GR-63 office vibration test and the CISPR 22 class A test for EMC. The results confirm that the module is suitable for practical use in the optical cross-connect systems.

Keywords

micro-optomechanical devices; microswitches; optical switches; 3D-MEMS optical switch module; CISPR 22 class A test; EMC; Telcordia GR-63; office vibration test; optical cross-connect systems; simultaneous optical paths connection; temperature -5 degC to 50 degC; Fabrics; Micromechanical devices; Mirrors; Optical arrays; Optical collimators; Optical control; Optical crosstalk; Optical losses; Optical switches; Prototypes; Cross-connect; Optical MEMS; Optical switch;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics in Switching, 2009. PS '09. International Conference on

Conference_Location

Pisa

Print_ISBN

978-1-4244-3857-0

Electronic_ISBN

978-1-4244-3856-3

Type

conf

DOI

10.1109/PS.2009.5307744

Filename

5307744