• DocumentCode
    2236017
  • Title

    Single-minute exchange of die

  • Author

    Agustin, Roberto O. ; Santiago, Fely

  • Author_Institution
    Intel, Philippines
  • fYear
    1996
  • fDate
    12-14 Nov 1996
  • Firstpage
    214
  • Lastpage
    217
  • Abstract
    In a high volume manufacturing, fast equipment setups play an important part in maximizing the capability of our equipment. With the increasing product demands and shifting from weekly to daily scheduling sales order, its is expected that production line will be “jerked” to meet the needs of our customers. This is where Single-Minute Exchange of Die (SMED) application is necessary. To implement SMED in Manila, a core team was formed to drive this program. The team was composed of industrial and equipment engineers from different manufacturing operations with support from Technical Training. Focus was initially set on critical stations that have long setup times, With the application of SMED, improvements were substantial with initial data showing reduction of setup time ranging from 25% to as high as 85%. With the reduced setup time, production flexibility expanded as it was able to afford more Frequent product mix changes. In addition, machine utilization and equipment capacity went up with the reduced setup time
  • Keywords
    flexible manufacturing systems; human resource management; integrated circuit manufacture; production control; SMED; daily scheduling; equipment capacity; equipment setups; high volume manufacturing; machine utilization; manufacturing operations; product mix changes; production flexibility; production line; setup time; single-minute exchange of die; Fluctuations; Industrial training; Job shop scheduling; Joining processes; Manufacturing industries; Marketing and sales; Production facilities; Production planning; Productivity; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-3371-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1996.558001
  • Filename
    558001