• DocumentCode
    2236027
  • Title

    A platform for three-dimensional on-chip photonics: Multi-bonded Silicon-on-insulator wafers

  • Author

    Hosseini, Amir ; Fallahazad, Babak ; Kwong, David N. ; Zhang, Yang ; Tutuc, Emanuel ; Chen, Ray T.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2011
  • fDate
    1-6 May 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We propose a novel platform for three dimensional photonics. A double layer 1×12 multimode interference coupler is fabricated on a double-bounded Silicon-on-insulator wafer. Optical characterizations confirm low insertion loss and uniform outputs.
  • Keywords
    integrated optics; optical couplers; silicon-on-insulator; three-dimensional integrated circuits; wafer bonding; double bounded silicon-on-insulator wafer; multibonded silicon-on-insulator wafers; multimode interference coupler; three dimensional on chip photonics; three dimensional photonics; Couplers; Etching; Integrated optics; Optical waveguides; Photonics; Silicon; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2011 Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4577-1223-4
  • Type

    conf

  • Filename
    5950455
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2236027