Title :
Reliability Study of 0.15um MHEMT with Vds≫3V Bias for Amplifier Application
Author :
Chen, S.C. ; Chou, H.C. ; Chou, Frank ; Hsieh, Iris ; Tu, D.W. ; Wang, Y.C. ; Wu, C.S. ; Nelson, S.R.
Author_Institution :
WIN Semicond. Corp. #69, Tao Yuan Shien
Abstract :
MHEMT technology using metamorphic buffer layers growing on GaAs substrate can overcome InP substrate issues. Several researchers have demonstrated reliable MHEMT devices, mainly with the drain bias at 1 V. This work, however, demonstrated for the first time MHEMT devices operated at drain voltage greater than 3 V for the amplifier application. We have demonstrated the power MHEMT at 3.5V drain bias with Ea of 1.53eV and MTTF of 2.32x106 hours at Teh of 125degC on WIN Semiconductors´1 technology. We also found that stressed voltage bias plays a more important role than the current density in short-term reliability evaluation.
Keywords :
amplifiers; buffer layers; power HEMT; semiconductor technology; MHEMT technology; amplifier application; drain voltage; metamorphic buffer layers; reliability study; semiconductor technology; voltage bias; Current density; Gallium arsenide; Space technology; Substrates; Temperature; Testing; Thermal degradation; Thermal stresses; Voltage; mHEMTs;
Conference_Titel :
ROCS Workshop, 2007.[Reliability of Compound Semiconductors Digest]
Conference_Location :
Portland, OR
Print_ISBN :
978-0-7908-0115-5
DOI :
10.1109/ROCS.2007.4391061