DocumentCode :
2236635
Title :
Intrinsic Reliability of a 12 volt Field Plate pHEMT Measured using Conventional and Step Stress Methods
Author :
Gaw, Craig ; Arnold, Thomas ; Moore, Karen
Author_Institution :
Freescale Semicond. Inc., Tempe
fYear :
2007
fDate :
14-14 Oct. 2007
Firstpage :
65
Lastpage :
84
Abstract :
High voltage 12 volt GaAs-based pHEMT devices are a commercial work horse for higher frequency infrastructure applications, including cable television, cellular base stations, and, potentially, WiMAXtrade. For the device described here a self-aligned field plate was integrated into Freescale´s production 12 volt pHEMT process to achieve high breakdown (> 30 volt) and high gain for 3.55 GHz operation. The reliability of this 12 volt field plate pHEMT device was evaluated using both a conventional three temperature DC accelerated stress test and a series of temperature step stress tests at a current stress level of 70 mA/mm. The current acceleration factor was measured and then used to predict the reliability at the actual device use condition of 30 mA/mm. For the targeted infrastructure applications the 12 volt field plate pHEMT device exceeds the reliability target at TCHANNEL = 150degC of 20 years of operation at a 1 ppm degradation level by a wide margin.
Keywords :
III-V semiconductors; gallium arsenide; high electron mobility transistors; low-power electronics; semiconductor device reliability; GaAs; GaAs - Interface; current acceleration factor; pHEMT; step stress methods; temperature step stress tests; three temperature DC accelerated stress test; voltage 12 V; Base stations; Cable TV; Frequency; Horses; PHEMTs; Stress measurement; Temperature; Testing; Voltage; WiMAX;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ROCS Workshop, 2007.[Reliability of Compound Semiconductors Digest]
Conference_Location :
Portland, OR
Print_ISBN :
978-0-7908-0115-5
Type :
conf
DOI :
10.1109/ROCS.2007.4391062
Filename :
4391062
Link To Document :
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