DocumentCode :
2237268
Title :
A 4×12.5 Gb/s CWDM Si photonics link using integrated hybrid silicon lasers
Author :
Koch, Brian ; Alduino, Andrew ; Liao, Ling ; Jones, Richard ; Morse, Michael ; Kim, Brian ; Lo, Wei-Zen ; Basak, Juthika ; Liu, Hai-Feng ; Rong, Haisheng ; Sysak, Mathew ; Krause, Christine ; Saba, Rushdy ; Lazar, Dror ; Horwitz, Lior ; Bar, Roi ; Litski,
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2011
fDate :
1-6 May 2011
Firstpage :
1
Lastpage :
2
Abstract :
We demonstrate a 4λ × 12.5Gbps Silicon Photonics CWDM link integrating all optical components, electronics, and packaging technologies required to form the link.
Keywords :
electronics packaging; elemental semiconductors; integrated optics; semiconductor lasers; silicon; wavelength division multiplexing; CWDM link; Si; electronics technology; integrated hybrid silicon lasers; optical components; packaging technology; silicon photonics link; Integrated optics; Optical device fabrication; Optical receivers; Optical transmitters; Photonics; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2011 Conference on
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4577-1223-4
Type :
conf
Filename :
5950504
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2237268
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