• DocumentCode
    2237268
  • Title

    A 4×12.5 Gb/s CWDM Si photonics link using integrated hybrid silicon lasers

  • Author

    Koch, Brian ; Alduino, Andrew ; Liao, Ling ; Jones, Richard ; Morse, Michael ; Kim, Brian ; Lo, Wei-Zen ; Basak, Juthika ; Liu, Hai-Feng ; Rong, Haisheng ; Sysak, Mathew ; Krause, Christine ; Saba, Rushdy ; Lazar, Dror ; Horwitz, Lior ; Bar, Roi ; Litski,

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2011
  • fDate
    1-6 May 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We demonstrate a 4λ × 12.5Gbps Silicon Photonics CWDM link integrating all optical components, electronics, and packaging technologies required to form the link.
  • Keywords
    electronics packaging; elemental semiconductors; integrated optics; semiconductor lasers; silicon; wavelength division multiplexing; CWDM link; Si; electronics technology; integrated hybrid silicon lasers; optical components; packaging technology; silicon photonics link; Integrated optics; Optical device fabrication; Optical receivers; Optical transmitters; Photonics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2011 Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4577-1223-4
  • Type

    conf

  • Filename
    5950504