DocumentCode :
2237301
Title :
Review of 3D high density storage class memory (SCM) architecture
Author :
Lee, Brian
Author_Institution :
Petari USA
fYear :
2012
fDate :
23-25 April 2012
Firstpage :
1
Lastpage :
1
Abstract :
This paper describes a fundamental building block and architecture of future high density storage class memory products. A review of 3D architecture is presented. A detailed review of cross point select devices and memory cells are conducted followed by their integration scheme. A critical review of its challenges and potential solutions are proposed.
Keywords :
Abstracts; Architecture; Buildings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on
Conference_Location :
Hsinchu, Taiwan
ISSN :
1930-8868
Print_ISBN :
978-1-4577-2083-3
Type :
conf
DOI :
10.1109/VLSI-TSA.2012.6210107
Filename :
6210107
Link To Document :
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