Title :
Advanced chemical downstream etch and strip capability
Author_Institution :
Appl. Mater., Santa Clara, CA, USA
Abstract :
Semiconductor manufacturing has slowly but surely been moving from wet etch and strip towards all-dry processing. With the advent of dry isotropic chambers on cluster tool platforms, it is now more attractive than ever to integrate several wet/dry steps into a single all-dry sequence. Target applications include isotropic oxide etch, high-selectivity nitride and poly strip and a variety of soft etches for damage, contaminant and residue removal
Keywords :
integrated circuit technology; sputter etching; surface contamination; all-dry processing; chemical downstream etch; cluster tool platforms; dry isotropic chambers; high-selectivity nitride; isotropic oxide etch; poly strip; semiconductor manufacturing; soft etches; strip capability; wet/dry steps; Chemicals; Dry etching; Hardware; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma sources; Semiconductor device manufacture; Strips; Wet etching;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-3371-3
DOI :
10.1109/ASMC.1996.558027
