A new complete diagnosis patterns for wiring interconnects

It is important to test the various kinds of interconnect faults between chips on a card/module. When boundary scan design techniques are adopted, the chip to chip interconnection test generation and application of test patterns is greatly simplified. Various test generation algorithms have been developed for interconnect faults. A new interconnect test generation algorithm is introduced. It reduces the number of test patterns by half over present techniques. It also guarantees the complete diagnosis of multiple interconnect faults