DocumentCode :
2238294
Title :
Advanced power copper technology for SMARTMOSTM application designs
Author :
Pages, I. ; Baird, B. ; Wang, J. ; Sicard, T. ; Dorkel, J.M. ; Dupuy, P. ; Lance, P. ; Huynh, E. ; Chung, Y.
Author_Institution :
Motorola Semicond., Toulouse, France
fYear :
2000
fDate :
2000
Firstpage :
141
Lastpage :
144
Abstract :
Cost effective automotive applications and the related circuit designs are requiring new SMARTMOSTM technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications
Keywords :
MOS integrated circuits; automotive electronics; copper; integrated circuit design; integrated circuit metallisation; power integrated circuits; SMARTMOS; advanced power copper technology; automotive applications; circuit designs; electronic modules; energy capability; metal debiasing; metallization; smart power devices; Automotive applications; Circuit synthesis; Coils; Copper; Integrated circuit metallization; Integrated circuit technology; Pulse shaping methods; Silicon; Switches; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2000. Proceedings. The 12th International Symposium on
Conference_Location :
Toulouse
ISSN :
1063-6854
Print_ISBN :
0-7803-6269-1
Type :
conf
DOI :
10.1109/ISPSD.2000.856791
Filename :
856791
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2238294
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