• DocumentCode
    2238294
  • Title

    Advanced power copper technology for SMARTMOSTM application designs

  • Author

    Pages, I. ; Baird, B. ; Wang, J. ; Sicard, T. ; Dorkel, J.M. ; Dupuy, P. ; Lance, P. ; Huynh, E. ; Chung, Y.

  • Author_Institution
    Motorola Semicond., Toulouse, France
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    141
  • Lastpage
    144
  • Abstract
    Cost effective automotive applications and the related circuit designs are requiring new SMARTMOSTM technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications
  • Keywords
    MOS integrated circuits; automotive electronics; copper; integrated circuit design; integrated circuit metallisation; power integrated circuits; SMARTMOS; advanced power copper technology; automotive applications; circuit designs; electronic modules; energy capability; metal debiasing; metallization; smart power devices; Automotive applications; Circuit synthesis; Coils; Copper; Integrated circuit metallization; Integrated circuit technology; Pulse shaping methods; Silicon; Switches; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 2000. Proceedings. The 12th International Symposium on
  • Conference_Location
    Toulouse
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-6269-1
  • Type

    conf

  • DOI
    10.1109/ISPSD.2000.856791
  • Filename
    856791
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2238294