Title :
Investigation of solder bridging failure for molded matrix array package
Author :
Chong Kim Foong ; Wong Shaw Fong ; Leong Jenn Seong ; He Yi ; Lee Chee Kan ; Kim Kay
Author_Institution :
Intel Technol. Sdn. Bhd., Bayan Lepas, Malaysia
Abstract :
Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.
Keywords :
ball grid arrays; failure analysis; BGA; ball grid array packages; localized unit coplanarity; materials characterization effort; modeling study; mold compound properties; molded matrix array package; package coplanarity; solder bridging failure; substrate design;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2012.6521761
