DocumentCode
2240393
Title
Investigation of solder bridging failure for molded matrix array package
Author
Chong Kim Foong ; Wong Shaw Fong ; Leong Jenn Seong ; He Yi ; Lee Chee Kan ; Kim Kay
Author_Institution
Intel Technol. Sdn. Bhd., Bayan Lepas, Malaysia
fYear
2012
fDate
6-8 Nov. 2012
Firstpage
1
Lastpage
6
Abstract
Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.
Keywords
ball grid arrays; failure analysis; BGA; ball grid array packages; localized unit coplanarity; materials characterization effort; modeling study; mold compound properties; molded matrix array package; package coplanarity; solder bridging failure; substrate design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location
Ipoh
ISSN
1089-8190
Print_ISBN
978-1-4673-4384-8
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2012.6521761
Filename
6521761
Link To Document