DocumentCode
2240757
Title
Multilevel interconnection technologies and future requirements for logic applications
Author
Brillouet, M.
Author_Institution
CNET, Crolles, France
fYear
1997
fDate
16-19 March 1997
Firstpage
36
Lastpage
39
Abstract
As the density of integration of logic functions increases, the performance and cost of the logic ICs is more and more dominated by the interconnection system. While the semiconductor industry was able to stay for a long time with the classical Al/Si0/sub 2/ system, there is a growing trend to move to new interconnect materials.
Keywords
integrated circuit interconnections; integrated circuit reliability; logic arrays; technological forecasting; interconnect materials; interconnection system; logic ICs; logic applications; multilevel interconnection technologies; semiconductor industry; Atherosclerosis; Capacitance; Dielectric constant; Dielectric materials; Logic; Materials reliability; Plugs; Power system interconnection; Power system reliability; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1997.621050
Filename
621050
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