DocumentCode
2241497
Title
Large area mold embedding technology with PCB based redistribution
Author
Braun, Torsten ; Becker, Karl-Friedrich ; Bottcher, L. ; Ostmann, Andreas ; Jung, Edward ; Voges, S. ; Thomas, Tessamma ; Kahle, R. ; Bader, Volker ; Bauer, J. ; Aschenbrenner, R. ; Schneider Ramelow, M. ; Lang, K.-D.
Author_Institution
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
fYear
2012
fDate
6-8 Nov. 2012
Firstpage
1
Lastpage
7
Abstract
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location
Ipoh, Perak, Malaysia
ISSN
1089-8190
Print_ISBN
978-1-4673-4384-8
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2012.6521803
Filename
6521803
Link To Document