• DocumentCode
    2241904
  • Title

    The ATPG Conflict-Driven Scheme for High Transition Fault Coverage and Low Test Cost

  • Author

    Chen, Zhen ; Xiang, Dong ; Yin, Boxue

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    3-7 May 2009
  • Firstpage
    146
  • Lastpage
    151
  • Abstract
    This paper presents two new conflict-driven techniques for improving transition fault coverage using multiple scan chains. These techniques are based on a novel test application scheme, in order to break the functional dependency of broadside testing. The two new techniques analyze the ATPG conflicts in broadside test generation, and try to control the flip-flops with most influence on the fault coverage.The conflict-driven method selects some flip-flops that work in the enhanced mode and distributes them into different chains. In the multiple scan chain architecture, to avoid too many scan-in pins, some chains are driven by the same scan-in pin to construct a tree-based architecture. Based on the architecture, the new test application scheme allows some flip-flops working in the enhanced mode, while most of others working in the traditional broadside mode. With the efficient conflict-driven selection method, fault coverage is improved greatly, which can also reduce test application time and compress test data volume. Experimental results show that fault coverage based on the proposed method is comparable to the enhanced scan.
  • Keywords
    automatic test pattern generation; flip-flops; logic testing; ATPG conflict-driven scheme; broadside test generation; flip-flops; high transition fault coverage; multiple scan chain; Automatic test pattern generation; Circuit faults; Circuit testing; Costs; Educational technology; Fault detection; Flip-flops; Paper technology; Software testing; System testing; broadside; conflit-driven; enhanced scan; fault coverage; test cost;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium, 2009. VTS '09. 27th IEEE
  • Conference_Location
    Santa Cruz, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-0-7695-3598-2
  • Type

    conf

  • DOI
    10.1109/VTS.2009.15
  • Filename
    5116625