• DocumentCode
    2242945
  • Title

    A new passive CMOS telemetry chip to receive power and transmit data for a wide range of sensor applications

  • Author

    Dudenbostel, Dirk ; Krieger, Karl-Ludwig ; Candler, Claudia ; Laur, Rainer

  • Author_Institution
    Inst. for Electromagnetic Theory & Microelectron., Bremen Univ., Germany
  • Volume
    2
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    995
  • Abstract
    A new full integrated telemetry chip with the possibility of integrated micro coils on the chip is presented. The telemetry chip receives the power for the sensor microsystem. Using a passive modulation technique the telemetry chip transmits measured data to the external power transmitter. In order to verify the performance of the telemetry chip, the transfer channel between the external transmitter and the receiver with the circuits of the telemetry chip have been simulated with SPICE. Measurements of a produced telemetry chip were made to confirm our technical concept and they verify the full operation of our telemetry chip
  • Keywords
    CMOS integrated circuits; SPICE; circuit analysis computing; coils; digital simulation; electric sensing devices; telemetry; SPICE simulation; external power transmitter; micro coils; passive CMOS telemetry chip; passive modulation technique; sensor applications; transfer channel; Clocks; Coils; RLC circuits; Radio frequency; Semiconductor device measurement; Telemetry; Temperature sensors; Transmitters; Voltage control; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.635305
  • Filename
    635305