DocumentCode :
2243277
Title :
Simple alignment technique for molding and transfer of 3D PDMS structure using the mechanical alignment jig
Author :
Jeong, Jinwoo ; Chun, Kukjin ; Kim, Jongpal ; Lee, Byeungleul
Author_Institution :
Dept. of Electr. Eng., Seoul Nat. Univ., Seoul, South Korea
fYear :
2009
fDate :
23-25 Sept. 2009
Firstpage :
1
Lastpage :
4
Abstract :
Simple alignment technique for the purpose of PDMS molding and transfer is proposed. In order to realize suggested technique, specially designed mechanical jig is devised. This jig helps the mechanical alignment and the clamping of the same-sized wafers. Silicon-on-glass wafer is used as a carrier substrate of the thin PDMS structure. 3D PDMS structure for the cap of sensor has been molded and transferred to the sensor using the jig. Though principle and procedure of alignment is very simple, relatively high alignment precision of 10 mum has been achieved. All caps of the sensor chips have survived without peeling during dicing process.
Keywords :
micromechanical devices; polymer structure; transfer moulding; wafer bonding; wafer level packaging; 3D PDMS structure; PDMS molding; PDMS transfer; Si-SiO2; carrier substrate; mechanical alignment jig technique; polydimethylsiloxane structure; sensor chips; silicon-on-glass wafer; wafer level; Biological materials; Biomembranes; Bonding; Educational technology; Mechanical sensors; Optical films; Optical sensors; Packaging; Plasma applications; Surface treatment; PDMS transfer; PMDS molding; mechanical alignment; wafer level;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
AFRICON, 2009. AFRICON '09.
Conference_Location :
Nairobi
Print_ISBN :
978-1-4244-3918-8
Electronic_ISBN :
978-1-4244-3919-5
Type :
conf
DOI :
10.1109/AFRCON.2009.5308216
Filename :
5308216
Link To Document :
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