DocumentCode :
2244229
Title :
Challenge to off-roadmap silicon devices
Author :
Toriumi, Akira
Author_Institution :
Adv. LSI Technol. Lab., Toshiba Corp., Kawasaki, Japan
Volume :
1
fYear :
2000
fDate :
2000
Abstract :
Summary form only given. The annual Si Roadmap is now a technology driver in the Si CMOS miniaturization. It is difficult, however, to forecast realistically what is the post CMOS technology. On the other hand, several new Si devices have been proposed. The single electron tunneling devices have been demonstrated using novel Si process technology. The Esaki diode has been recently revived as the three-terminal NDR (Negative Differential Resistance) device. Moreover, the challenge of ultra-high performance devices using the strained Si substrate is also interesting. All of them are not on the roadmap, but possess unique device characteristics. Since we are just facing intrinsic hardships in CMOS technology, we hope that the off-roadmap devices might lead to opening a new way rather than extending the roadmap. In this paper, several off-roadmap Si devices are demonstrated and discussed for possible applications
Keywords :
MIS devices; negative resistance devices; semiconductor technology; single electron transistors; tunnel diodes; CMOS; Esaki diode; Si; off-roadmap semiconductor devices; single electron tunneling devices; technology driver; three-terminal NDR; ultra-high performance devices; CMOS technology; Diodes; Electrons; Laboratories; Large scale integration; Research and development; Silicon devices; Technology forecasting; Thickness control; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location :
Geneva
Print_ISBN :
0-7803-5482-6
Type :
conf
DOI :
10.1109/ISCAS.2000.857080
Filename :
857080
Link To Document :
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