• DocumentCode
    2244493
  • Title

    Coupled fluid-thermo-structures simulation methodology for MEMS applications

  • Author

    Athavale, M.M. ; Yang, H.Q. ; Przekwas, A.J.

  • Author_Institution
    CFD Res. Corp., Huntsville, AL, USA
  • Volume
    2
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    1043
  • Abstract
    A coupled fluid-thermo-structures solution methodology is being developed for application to MEMS. State-of-the-art computational methods are used for simulation of a wide variety of MEMS types and configurations. The proposed software is aimed to be powerful and accurate, yet simple and quick enough to be included in the design cycles of microfluidic devices for performance predictions and device optimization. A distinct feature of the present computational methodology is the fully implicit numerical coupling between all disciplines. A description of the various solver modules is presented. The accuracy of the current software is validated on a benchmark quality experiments of a flow in a microchannel and fluid-structure interaction case. The versatility is demonstrated on two practical microfluidic devices
  • Keywords
    channel flow; digital simulation; engineering computing; flow simulation; fluidic devices; micropumps; numerical analysis; semiconductor device models; valves; MEMS applications; benchmark quality experiments; computational methods; coupled fluid-thermo-structures simulation methodology; design cycles; device optimization; dynamic valves; fluid-structure interaction; implicit numerical coupling; microchannel flow; microfluidic devices; micropump; performance predictions; software accuracy; solver modules; Application software; Computational fluid dynamics; Computational modeling; Design optimization; Fluid flow; Microchannel; Microelectromechanical devices; Microfluidics; Micromechanical devices; Micropumps;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.635364
  • Filename
    635364