DocumentCode
2244742
Title
Residual Layer Distribution on Embossing Process for Photonic Devices
Author
Choi, Chul-Hyun ; Lee, Min Woo ; Sung, Jun-Ho ; Kim, Bo-Soon ; Lee, Seung-Gol ; O, Beom-Hoan
Author_Institution
Sch. of Inf. & Commun. Eng., INHA Univ., Incheon
fYear
2007
fDate
26-31 Aug. 2007
Firstpage
1
Lastpage
2
Abstract
We report on the behavior and effect of the residual layer left on the substrate after embossing process for the fabrication of photonic devices. The PDMS material was used as mold, and thermal and UV curable polymers was adapted for the fabrication of demultiplexer and optical power splitter, respectively.
Keywords
demultiplexing equipment; embossing; integrated optics; optical beam splitters; optical fabrication; optical polymers; PDMS material; UV curable polymers; demultiplexer; embossing process; optical power splitter; photonic devices; residual layer distribution; thermal curable polymers; Costs; Embossing; Mass production; Microstructure; Optical device fabrication; Optical devices; Optical materials; Optical polymers; Optical waveguides; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on
Conference_Location
Seoul
Print_ISBN
978-1-4244-1173-3
Electronic_ISBN
978-1-4244-1174-0
Type
conf
DOI
10.1109/CLEOPR.2007.4391422
Filename
4391422
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