Title :
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)
Abstract :
The following topics are dealt with: materials/processes; adhesives; modeling and testing; packaging reliability; advanced packaging; flip chip; core electronic materials; and solders
Keywords :
adhesives; electronic equipment testing; flip-chip devices; packaging; production testing; reliability; soldering; adhesives; advanced packaging; core electronic materials; flip chip; modeling; packaging reliability; solders; testing;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island, South Korea
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983946
