Title :
Effects of particle size on dielectric constant and leakage current of epoxy/barium titanate (BaTiO3) composite films for embedded capacitors
Author :
Cho, Sung-Dong ; Lee, Joo-Yeon ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Abstract :
Polymer/ceramic composite film is of great interest as dielectric material for embedded capacitor applications. In this paper, effects of powder size on dielectric constant and leakage current of epoxy/BaTiO 3 composite film fabricated by spin-coating were investigated using bisphenol-A type epoxy and 6 kinds of barium titanate powders with diameter ranges of 0.1-0.9 μm. Dielectric constant of the composite films increased as particle size increased. This was due to tetragonality increase, which was observed by XRD analysis, with particle size increase. In addition to tetragonality, better dispersibility also contributed to high dielectric constant of bigger powder. Leakage current of composite films increased dramatically as particle size increased. It is presumably due to the decrease of the number of particles per unit length, resulting in decrease of the number of contacts. As the number of contacts acting as a potential barrier reduces, potential barrier lowering effects become larger. When we use larger powder, we can obtain higher dielectric constant with larger leakage current. As a result, there is tradeoff between high dielectric constant and low leakage current, and 0.5~0.7 μm size powder would be optimum for embedded capacitor applications
Keywords :
X-ray diffraction; capacitors; filled polymers; leakage currents; particle size; permittivity; 0.1 to 0.9 micron; 0.5 to 0.7 micron; BaTiO3; XRD analysis; dielectric constant; dispersibility; embedded capacitors; leakage current; particle size; polymer/ceramic composite film; potential barrier; powder size; spin-coating; tetragonality; Barium; Capacitors; Ceramics; Dielectric constant; Dielectric materials; High-K gate dielectrics; Leakage current; Polymer films; Powders; Titanium compounds;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983959