• DocumentCode
    2246616
  • Title

    Formation of ultra-thin PtSi layers with a 2-step silicidation process

  • Author

    Donaton, R.A. ; Jin, S. ; Bender, H. ; Maex, K. ; Vantomme, A. ; Langouche, G.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    118
  • Lastpage
    119
  • Abstract
    We propose a new technique to form ultra-thin PtSi layers based on sputter deposition of the metal and two-step silicidation by rapid thermal processing, which are production tools used in standard silicon processing technologies.
  • Keywords
    chemical interdiffusion; metallic thin films; metallisation; platinum compounds; rapid thermal processing; sputter deposition; PtSi; rapid thermal processing; silicon technology; sputter deposition; two-step silicidation; ultra-thin PtSi layer; Atomic force microscopy; Inorganic materials; Silicidation; Silicides; Silicon; Sputter etching; Sputtering; Substrates; Thickness control; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1997.621080
  • Filename
    621080