DocumentCode
2246716
Title
Electrical characteristics of single and coupled stripline on meshed ground plane in high-speed package
Author
Lee, Heeseok ; Kim, Joungho
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear
2001
fDate
2001
Firstpage
261
Lastpage
267
Abstract
In high-speed packages, the high-frequency characteristic of the interconnection structure becomes increasingly important. In this paper, the propagation characteristics of the stripline placed on the meshed ground plane (SMEP) are determined. The effective dielectric constant and the characteristic impedance of the single SMEP are determined by utilizing the full-wave analysis. For the longitudinally periodic structure modeling of SMEP, the finite-difference time-domain method based on Floquet´s theorem is used. The slow wave effect and the high impedance characteristic are observed. In addition to the single SMEP analysis, the propagation and coupling property of the coupled SMEP is also presented, which is very important in the cross-talk modeling
Keywords
circuit analysis computing; crosstalk; electric impedance; electromagnetic wave propagation; finite difference time-domain analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit packaging; periodic structures; permittivity; strip line circuits; Floquet´s theorem; SMEP; characteristic impedance; coupled SMEP; coupled stripline; coupling property; cross-talk modeling; effective dielectric constant; electrical characteristics; finite-difference time-domain method; full-wave analysis; high-frequency characteristic; high-speed package; interconnection structure; longitudinally periodic structure modeling; meshed ground plane; propagation characteristics; single SMEP analysis; single stripline; slow wave effect; Crosstalk; Electric variables; Impedance; Integrated circuit interconnections; Microprocessors; Packaging; Power system interconnection; Power transmission lines; Stripline; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location
Jeju Island
Print_ISBN
0-7803-7157-7
Type
conf
DOI
10.1109/EMAP.2001.983995
Filename
983995
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