• DocumentCode
    2246716
  • Title

    Electrical characteristics of single and coupled stripline on meshed ground plane in high-speed package

  • Author

    Lee, Heeseok ; Kim, Joungho

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    261
  • Lastpage
    267
  • Abstract
    In high-speed packages, the high-frequency characteristic of the interconnection structure becomes increasingly important. In this paper, the propagation characteristics of the stripline placed on the meshed ground plane (SMEP) are determined. The effective dielectric constant and the characteristic impedance of the single SMEP are determined by utilizing the full-wave analysis. For the longitudinally periodic structure modeling of SMEP, the finite-difference time-domain method based on Floquet´s theorem is used. The slow wave effect and the high impedance characteristic are observed. In addition to the single SMEP analysis, the propagation and coupling property of the coupled SMEP is also presented, which is very important in the cross-talk modeling
  • Keywords
    circuit analysis computing; crosstalk; electric impedance; electromagnetic wave propagation; finite difference time-domain analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit packaging; periodic structures; permittivity; strip line circuits; Floquet´s theorem; SMEP; characteristic impedance; coupled SMEP; coupled stripline; coupling property; cross-talk modeling; effective dielectric constant; electrical characteristics; finite-difference time-domain method; full-wave analysis; high-frequency characteristic; high-speed package; interconnection structure; longitudinally periodic structure modeling; meshed ground plane; propagation characteristics; single SMEP analysis; single stripline; slow wave effect; Crosstalk; Electric variables; Impedance; Integrated circuit interconnections; Microprocessors; Packaging; Power system interconnection; Power transmission lines; Stripline; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
  • Conference_Location
    Jeju Island
  • Print_ISBN
    0-7803-7157-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2001.983995
  • Filename
    983995